Lithography

Ultra Violet Lithography Process Part 1

A low-cost microscope projection photolithography system for high-resolution fabrication

Ultra Violet Lithography Process Part 1

Overview

This project demonstrates a high-resolution UV projection system using a DLP470NE digital micromirror device (DMD) and a Nikon Plan Apo VC objective lens for sub-micron lithographic imaging. It is designed for applications that demand precision micro-patterning and optical lithography at near-diffraction-limited resolution.

Aims

  • Implement a sub-micron lithographic projector system using a DLP chip and high-NA objective.
  • Goal: Achieve 270nm projected pixel pitch at 405nm UV wavelength, with resolving power down to ~329nm.
  • Target Application: Microscale fabrication, biomedical microstructures, and lab-on-chip prototyping.

System Specifications

DMD Chip

PropertySpecification
TypeDLP470NE (0.47-inch 1080p DMD)
Resolution1920 x 1080
Pixel Pitch5.4 µm
Active Area5.832 mm (H) x 10.368 mm (W)

DMD provides high pixel density with fast frame switching, ideal for maskless projection lithography.

Objective Lens

PropertySpecification
ModelNikon Plan Apo VC 20x
Magnification20x Demagnification
UV CorrectionUp to 405 nm
Numerical Aperture0.75
Working Distance1 mm
Depth of Focus0.48 µm
Field of View (FOV)1.25 mm diameter
Theoretical Resolution(0.61 x λ) / NA = 329 nm (λ = 405 nm)

With a depth of focus of less than 0.5 µm, focus adjustment is critical for sharp feature transfer.

Projection Calculations

Projected Image Size

Using the 20x demagnification from the objective:

  • Projected Height: 5.832 mm / 20 = 0.292 mm
  • Projected Width: 10.368 mm / 20 = 0.518 mm
  • Diagonal: √(0.292² + 0.518²) ≈ 0.354 mm

This falls well within the 1.25 mm field of view provided by the objective.

Pixel Size and Resolution

  • Projected Pixel Size: 5.4 µm / 20 = 270 nm
  • Objective Resolving Power: 329 nm @ 405 nm
  • Resolution Gap: 329 - 270 = 59 nm resolving mismatch

Projected pixel size is below the diffraction-limited resolution, meaning some features may not resolve cleanly due to the NA and wavelength limits.

Summary Table

ParameterValue
Projected Image Size0.292 mm x 0.518 mm
Projected Pixel Size270 nm
Diffraction-limited Res.329 nm (at 405 nm wavelength)
FOV of Objective Lens1.25 mm diameter
Working Distance1 mm
DOF (Depth of Focus)0.48 µm

Resources

All design files and simulation notebooks will be uploaded soon